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Pre-treatment of dielectrics and technological process for deposition of chemical copper layers from copper solution with improved ecological impact
Transactions of the IMF ( IF 1.9 ) Pub Date : 2020-03-03 , DOI: 10.1080/00202967.2020.1718941
M. Georgieva 1, 2 , V. Chakarova 2 , M. Petrova 2 , D. Lazarova 2 , D. Dobrev 1, 3
Affiliation  

ABSTRACT In the metallisation of dielectrics, this process and the deposited metal layer quality is influenced by the dielectric pre-treatment, and the solution compositions for both pre-treatment and metallisation are vital for establishing the optimum operating conditions for metal layer deposition. The investigations in this study were carried out on samples of acrylonitrile–butadiene-styrene (ABS – Novodur PM/2C Type, Bayer) with a working surface of 0.1 dm2. The investigated operations of the technological scheme for pre-treatment are as follows: degreasing, etching, reduction, pre-activation, activation. After passing through these operations, the ABS samples were subjected to chemical deposition of copper layers from a recently-developed solution. The copper layers were characterised by AFM, SEM, EDX, XRD and XPS analyses.

中文翻译:

从铜溶液中沉积化学铜层的电介质预处理和工艺流程,改善生态影响

摘要 在电介质的金属化过程中,该过程和沉积的金属层质量受电介质预处理的影响,预处理和金属化的溶液成分对于建立金属层沉积的最佳操作条件至关重要。本研究中的研究是在工作表面为 0.1 dm2 的丙烯腈-丁二烯-苯乙烯样品(ABS-Novodur PM/2C 型,拜耳)上进行的。前处理工艺方案考察的操作如下:脱脂、蚀刻、还原、预活化、活化。在完成这些操作后,ABS 样品通过最近开发的溶液进行铜层的化学沉积。通过AFM、SEM、EDX、XRD和XPS分析表征铜层。
更新日期:2020-03-03
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