This article is concerned with the mathematical analysis of models for Micro-Electro-Mechanical Systems (MEMS). These models arise in the form of coupled partial differential equations with a moving boundary. Although MEMS devices are often operated in non-isothermal environments, temperature is often neglected in the mathematical investigations. In light of this finding the focus of our modelling is to incorporate temperature and the related material properties. We derive a full model for this coupling and discuss a simplified version as well. Lastly, we prove local well-posedness in time and also global well-posedness under additional assumptions on the model’s parameters.

本文关注的是微机电系统（MEMS）模型的数学分析。这些模型以具有运动边界的耦合偏微分方程的形式出现。尽管MEMS器件通常在非等温环境下运行，但数学研究中常常忽略了温度。根据这一发现，我们建模的重点是结合温度和相关的材料特性。我们为这种耦合导出了一个完整的模型，并讨论了简化版本。最后，在模型参数的其他假设下，我们在时间上证明了本地的适度性，并在整体上证明了全局的适度性。