Three-dimensional ordered macroporous (3DOM) Cu films with the size 300–500 nm were prepared on FTO by colloidal crystal template-assisted electrodeposition in aqueous solution. The effects of electrodeposition methods and electrodeposition parameters on the morphology and structure of the 3DOM copper films were studied. It is found that the constant potential method is more suitable for the preparation of 3DOM copper films compared to the step electrodeposition method, the deposition voltage affects the grain size and the flatness of the copper film surface and the electrodeposition time affects the dimension and the number of layers of the copper films. The optical properties of the prepared 3DOM copper films were also analyzed.

在FTO上通过胶体晶体模板辅助电沉积在水溶液中制备尺寸为300–500 nm的三维有序大孔（3DOM）Cu膜。研究了电沉积方法和电沉积参数对3DOM铜膜的形貌和结构的影响。研究发现，与分步电沉积法相比，恒电位法更适合于制备3DOM铜膜，沉积电压影响晶粒大小和铜膜表面的平整度，而电沉积时间则影响尺寸和数量铜膜层数。还分析了所制备的3DOM铜膜的光学性质。