High volume fraction SiC particle reinforced Al-based MMCs (SiC/Al MMCs) were bonded by Ultrasonic-promoted transient-liquid-phase (UTLP) bonding with pure Zn foil as interlayer at 390 °C. Oxide films were removed totally attributing to ultrasonic vibration and liquid Zn-Al eutectic phase were formed. Ultrasonic vibration time extension promoted element diffusion and decreased the bonding wide because of vibration squeezing effect, which would shorten bonding time. But overlong ultrasonic time made SiC particles contact with each other result in poor joint quality. Sound joints obtained with ultrasonic vibration time of 60 s and the shear strength of joint is 134.4 MPa. The oxide films removed processes and UTLP joint formation mechanism of high volume fraction SiC/Al MMCs were discussed in details.

中文翻译：

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超声促进低温下高体积分数 SiC 颗粒增强铝基金属基复合材料的快速瞬态液相键合

高体积分数 SiC 颗粒增强的铝基 MMCs (SiC/Al MMCs) 通过超声波促进瞬态液相 (UTLP) 键合与纯 Zn 箔作为夹层在 390 °C 下键合。由于超声波振动，氧化膜被完全去除，并形成液态锌铝共晶相。超声波振动时间延长促进了元素扩散，并由于振动挤压效应而减小了键合范围，从而缩短了键合时间。但过长的超声时间使SiC颗粒相互接触导致接头质量差。超声振动时间为 60 s 得到的接头完好，接头剪切强度为 134.4 MPa。详细讨论了高体积分数SiC/Al MMCs的氧化膜去除工艺和UTLP接头形成机制。