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Passivated electrode side walls by atomic layer deposition on flexible polyimide based samples
Microelectronic Engineering ( IF 2.3 ) Pub Date : 2020-04-01 , DOI: 10.1016/j.mee.2020.111315
Markus Westerhausen , Tanja Martin , Michael Metzger , Felix Blendinger , Monika Fleischer , Boris Hofmann , Volker Bucher

Abstract The passivation of flexible implants is often realized by using polyimide due to its biostable and biocompatible properties. However, this coating is often opened above the electrode sites of electrode arrays to ensure an electrical connection between the microelectrodes and the tissue above. Especially the side walls of these hole-like openings are difficult to coat with protecting layers. Atomic Layer Deposition (ALD) leads to defect-free coatings even on complex 3D-shaped geometries. In our work, a TiO2-film was applied to the electrode surface as well as to the electrode side walls. Then the electrode surface was opened again, while the side wall of the hole in the polymer around the electrode remained protected. The electrical passivation of the side walls was measured with embedded ring electrodes by manufacturing a polyimide based multi-layered passivation with intermediate gold layers. These metal layers served as an electrical access to the electrode side walls and allowed their characterization. It could be shown that ALD is a suitable technology for protecting side walls of electrode openings in polyimide.

中文翻译:

在柔性聚酰亚胺基样品上通过原子层沉积钝化电极侧壁

摘要 由于聚酰亚胺的生物稳定性和生物相容性,通常使用聚酰亚胺来实现柔性植入物的钝化。然而,该涂层通常在电极阵列的电极位置上方开口,以确保微电极与上方组织之间的电连接。尤其是这些孔状开口的侧壁很难涂上保护层。即使在复杂的 3D 形状几何结构上,原子层沉积 (ALD) 也能产生无缺陷的涂层。在我们的工作中,TiO2 薄膜被应用于电极表面以及电极侧壁。然后再次打开电极表面,而电极周围聚合物中孔的侧壁仍然受到保护。通过制造具有中间金层的基于聚酰亚胺的多层钝化,使用嵌入的环形电极测量侧壁的电钝化。这些金属层用作电极侧壁的电气通路,并允许对其进行表征。可以证明,ALD 是一种适用于保护聚酰亚胺电极开口侧壁的技术。
更新日期:2020-04-01
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