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Sub-micron silver wires on non-planar polymer substrates fabricated by thermal nanoimprint and back injection molding
Microelectronic Engineering ( IF 2.3 ) Pub Date : 2020-02-22 , DOI: 10.1016/j.mee.2020.111274
Sijia Xie , Barbara Horváth , Jerome Werder , Helmut Schift

In back injection molding, a polymer film (most commonly a decorative label) is inserted into the mold and fused with the polymer product by injection of the polymer melt from behind. By placing a bendable film into a mold cavity and by injection of polymer melt, the film conforms to the outlines of the cavity, thus enabling the decoration of elements with non-planar surfaces. This technique allows for pre-patterning of films by a planar process, and then convert these into the surface skin of a non-planar molded part. In this research we demonstrate the integration of silver wires onto the surface of a curved polymer part. As an example, we used poly (methyl methacrylate) films of different thicknesses that were pre-structured with micrometer-sized V-grooves, filled with silver nanoparticle ink and placed into the cavity of a commercial injection molding tool. The effect of the back injection molding process on unfilled and filled V-grooves was evaluated for different process parameters. In most cases, the silver wires remained undamaged and their electrical conductivities remained essentially similar to those in planar films. The resulting surface-integrated silver wires were characterized by scanning electron microscopy and electrical resistivity measurements.



中文翻译:

通过热纳米压印和反注射成型在非平面聚合物基板上的亚微米银线

在反注射成型中,将聚合物薄膜(最常见的是装饰性标签)插入模具中,并通过从后面注入聚合物熔体将其与聚合物产品融合。通过将可弯曲的薄膜放入型腔中并通过注入聚合物熔体,使薄膜与型腔的轮廓相符,从而可以装饰具有非平面表面的元件。该技术允许通过平面工艺对膜进行预构图,然后将其转换为非平面模制零件的表面蒙皮。在这项研究中,我们演示了将银线集成到弯曲的聚合物零件的表面上。例如,我们使用了不同厚度的聚(甲基丙烯酸甲酯)薄膜,这些薄膜预先用微米级的V型槽制成,填充有银纳米粒子墨水,并放入商用注射成型工具的型腔中。对于不同的工艺参数,评估了反注射成型工艺对未填充和已填充的V形槽的影响。在大多数情况下,银线保持完好无损,其电导率基本上与平面膜中的相似。通过扫描电子显微镜和电阻率测量来表征所得的表面整合的银线。

更新日期:2020-04-14
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