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Radiated EMC Kron's Model of 3-D Multilayer PCB Aggressed by Broadband Disturbance
IEEE Transactions on Electromagnetic Compatibility ( IF 2.1 ) Pub Date : 2020-04-01 , DOI: 10.1109/temc.2019.2901670
Zhifei Xu , Blaise Ravelo , Olivier Maurice , Jonathan Gantet , Nicolas Marier

This paper focuses on novel modeling of radiated electromagnetic compatibility (EMC) coupling onto the multilayer printed circuit board (PCB). Kron's method integrates the electromagnetic (EM) emission, Taylor's, and field-to-interconnect coupling models. The equivalent graph of the field-to-interconnect coupling is established. The modeling methodology consists in defining the primitive sub-network elements (vias, interconnect lines, pads, and ground plane). Kron's graph equivalent to the EMC problem is elaborated. Finally, the coupling voltages are calculated via the tensorial equation translated from the graph. The radiated EMC Kron's model is validated with a four-layer PCB from 0.4 to 1.4 GHz by two scenarios of EM radiation. As proof-of-concept, a prototype of four-layer PCB was designed, fabricated, tested, and simulated in full wave with a commercial three-dimensional EM tool. For the first case, the multilayer PCB was illuminated by plane wave emission propagating in different directions. The numerical computation from Kron's formalism was compared with simulation and measurement. The other case is the field-to-interconnect coupling between a microstrip I-line PCB, as an EM field emitter, and the multilayer PCB, as a receiver, in 1-m distance. For both cases, the simulated and calculated voltage couplings onto the multilayer PCB are in good agreement.

中文翻译:

受宽带干扰影响的 3-D 多层 PCB 辐射 EMC Kron 模型

本文重点介绍辐射电磁兼容性 (EMC) 耦合到多层印刷电路板 (PCB) 的新颖建模。Kron 的方法集成了电磁 (EM) 发射、泰勒和场到互连耦合模型。建立了场到互连耦合的等效图。建模方法包括定义原始子网络元素(通孔、互连线、焊盘和接地平面)。详细阐述了等效于 EMC 问题的 Kron 图形。最后,耦合电压通过从图形转换而来的张量方程计算。辐射 EMC Kron 模型通过 0.4 至 1.4 GHz 的四层 PCB 通过两种电磁辐射场景进行验证。作为概念验证,设计、制造、测试了四层 PCB 的原型,并使用商用 3D EM 工具进行全波模拟。对于第一种情况,多层 PCB 被在不同方向传播的平面波辐射照亮。将 Kron 形式主义的数值计算与模拟和测量进行了比较。另一种情况是微带 I 线 PCB(作为 EM 场发射器)和多层 PCB(作为接收器)之间的场互连耦合,距离为 1 米。对于这两种情况,模拟和计算的多层 PCB 上的电压耦合非常一致。另一种情况是微带 I 线 PCB(作为 EM 场发射器)和多层 PCB(作为接收器)之间的场互连耦合,距离为 1 米。对于这两种情况,模拟和计算的多层 PCB 上的电压耦合非常一致。另一种情况是微带 I 线 PCB(作为 EM 场发射器)和多层 PCB(作为接收器)之间的场互连耦合,距离为 1 米。对于这两种情况,模拟和计算的多层 PCB 上的电压耦合非常一致。
更新日期:2020-04-01
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