当前位置: X-MOL 学术Virtual Phys. Prototyp. › 论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
Additive manufacturing of lightweight and high-strength polymer-derived SiOC ceramics
Virtual and Physical Prototyping ( IF 10.6 ) Pub Date : 2020-01-17 , DOI: 10.1080/17452759.2019.1710919
Ziyong Li 1 , Zhangwei Chen 1 , Jian Liu 1 , Yuelong Fu 1 , Changyong Liu 1 , Pei Wang 1 , Mingguang Jiang 1 , Changshi Lao 1
Affiliation  

ABSTRACT

Lightweight and high-strength polymer-derived SiOC ceramics with varied lattice structures have been successfully produced using different polysiloxanes as preceramic polymers (PCPs) via photopolymerisation-based digital-light-processing 3D printing and pyrolysis. Photocurable precursor resins were prepared by simple mixing of polysiloxanes with photosensitive acrylate monomers, achieving good flowability and preserving desirable stability under different heating and oscillation conditions. Complex micron-sized structures were manufactured with high precision via the optimisation of polymer formula and printing parameters. The printed PCPs pyrolysed at 600–1000°C preserved fine features with uniform shrinkage. The skeletons were almost fully dense, with smooth and flawless surfaces at macro/micro scale. Porosities and mechanical properties, including apparent compressive strength, elastic modulus, and indentation hardness, were characterised. XRD, FT-IR, Raman spectroscopy, and XPS were used to explore the chemical variations in elements and atomic bonds. High specific compressive strength to density ratios was obtained for the SiOC lattices compared with other porous ceramics.



中文翻译:

轻质和高强度聚合物衍生的SiOC陶瓷的增材制造

摘要

通过基于光聚合的数字光处理3D打印和热解技术,已成功使用不同的聚硅氧烷作为预陶瓷聚合物(PCP)成功生产了具有可变晶格结构的轻质高强度聚合物SiO2陶瓷。通过将聚硅氧烷与光敏丙烯酸酯单体简单混合即可制得可光固化的前体树脂,在不同的加热和振荡条件下,可实现良好的流动性并保持理想的稳定性。通过高精度制造复杂的微米级结构优化聚合物配方和印刷参数。印刷后的PCP在600–1000°C的温度下热解,保留了细小的特征,并具有均匀的收缩率。骨架几乎完全致密,在宏观/微观尺度上具有光滑无瑕的表面。表征了孔隙率和机械性能,包括表观抗压强度,弹性模量和压痕硬度。XRD,FT-IR,拉曼光谱和XPS用于探索元素和原子键的化学变化。与其他多孔陶瓷相比,SiOC晶格具有较高的比抗压强度与密度比。

更新日期:2020-04-20
down
wechat
bug