Gluing an antenna-on-chip (AoC) directly on a ground plane or heat sink in the lead frame is a standard process for commercial applications. To reduce the effect of losses in the silicon substrate and improve the antenna’s radiation efficiency, the wafer thickness is often drastically reduced. However, the close proximity of the antenna and ground plane can cause an impedance mismatch. Metal tiles, which are embedded in silicon dioxide layers, are designed as an artificial magnetic conductor (AMC) to increase the radiation efficiency and tune the antenna impedance. A double-layer AMC is applied instead of a single-layer AMC to reduce the silicon dielectric loss. Additionally, the double-layer AMC has more capacitance to tune the impedance when integrating with a monopole on-chip antenna. The resulting −10 dB impedance bandwidth is increased to 5.8 GHz around the 60 GHz band, the simulated realized gain increases by 3.3 dB, and the simulated antenna radiation efficiency is increased from 11% to 21%. The measured input impedance of the AoC shows good agreement with the simulation results after probe calibration.

中文翻译：

---

用于提高标准低成本封装中接地毫米波片上天线性能的片上金属平铺

将片上天线 (AoC) 直接粘合在引线框架中的接地平面或散热器上是商业应用的标准工艺。为了减少硅基板中损耗的影响并提高天线的辐射效率，通常会大幅降低晶圆厚度。然而，天线和地平面的接近会导致阻抗失配。嵌入二氧化硅层的金属瓦被设计为人造磁导体 (AMC)，以提高辐射效率并调整天线阻抗。应用双层AMC代替单层AMC以降低硅介电损耗。此外，当与单极片上天线集成时，双层 AMC 具有更大的电容来调整阻抗。由此产生的 -10 dB 阻抗带宽增加到 5。在60 GHz频段附近的8 GHz，模拟实现增益增加3.3 dB，模拟天线辐射效率从11%提高到21%。测得的 AoC 输入阻抗与探头校准后的仿真结果非常吻合。