A new model for accurate direction findings is presented, and the superiority of the proposed model is demonstrated over the existing models for real system requirements. The proposed model is constructed based on the phase center contour of each element in the array. It is also shown that the accuracy of the proposed model will remain for tightly coupled arrays while other models fail. A novel algorithm according to this new model is also proposed. The proposed algorithm is proved by both simulations and measurements to be a viable solution for indoor applications where strong multipath interferences exist in the environment. Furthermore, a detailed explanation of accurate direction finding in harsh environments is presented using ultra-miniaturized tightly coupled arrays. In general, the direction-of-arrival estimation accuracy deteriorates using such miniaturized arrays, whereas we have shown that an excellent estimation accuracy is achieved using the proposed model and the detection algorithm. This statement is substantiated for any environments regardless of the strength of interference. To validate the developed model and theory, several practical prototypes of tightly coupled arrays are fabricated using the typical FR4 printed-circuit-board (PCB) fabrication process. The prototypes are measured in several indoor scenarios at the presence of multipath. The results are studied in detail.

中文翻译：

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基于相位中心轮廓的紧耦合阵列设计，用于恶劣环境下的室内测向

提出了一种用于准确测向的新模型，并证明了所提出的模型优于现有模型的实际系统要求。所提出的模型是基于阵列中每个元素的相位中心轮廓构建的。还表明，当其他模型失败时，所提出模型的准确性对于紧耦合阵列将保持不变。还提出了根据该新模型的新算法。所提出的算法经仿真和测量证明是一种可行的解决方案，适用于环境中存在强多径干扰的室内应用。此外，还详细解释了使用超小型紧密耦合阵列在恶劣环境中精确测向的情况。一般来说，使用这种小型化阵列，到达方向估计精度会下降，而我们已经表明，使用所提出的模型和检测算法可以实现出色的估计精度。无论干扰强度如何，此声明都适用于任何环境。为了验证开发的模型和理论，使用典型的 FR4 印刷电路板 (PCB) 制造工艺制造了几个紧密耦合阵列的实用原型。在存在多径的情况下，在多个室内场景中测量原型。结果进行了详细研究。无论干扰强度如何，此声明都适用于任何环境。为了验证开发的模型和理论，使用典型的 FR4 印刷电路板 (PCB) 制造工艺制造了几个紧密耦合阵列的实用原型。在存在多径的情况下，在多个室内场景中测量原型。结果进行了详细研究。无论干扰强度如何，此声明都适用于任何环境。为了验证开发的模型和理论，使用典型的 FR4 印刷电路板 (PCB) 制造工艺制造了几个紧密耦合阵列的实用原型。在存在多径的情况下，在多个室内场景中测量原型。结果进行了详细研究。