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IEEE Transactions on Dielectrics and Electrical Insulation ( IF 3.1 ) Pub Date : 2020-03-25 , DOI: 10.1109/tdei.2020.9047069
IEEE Transactions on Dielectrics and Electrical Insulation ( IF 3.1 ) Pub Date : 2020-03-25 , DOI: 10.1109/tdei.2020.9047069
Provides instructions and guidelines to prospective authors who wish to submit manuscripts.
中文翻译:
[封底内页]
为希望提交手稿的准作者提供指导和指南。
更新日期:2020-04-22
中文翻译:
[封底内页]
为希望提交手稿的准作者提供指导和指南。