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Fabrication of the Ni-W-SiC thin film by pulse electrodeposition
Surface & Coatings Technology ( IF 5.4 ) Pub Date : 2020-04-05 , DOI: 10.1016/j.surfcoat.2020.125738
Pen Jin , Chufeng Sun , Zhonghui Zhang , Chunyu Zhou , Tom Williams

The present work reports the preparation of Ni-W-SiC thin films obtained by pulse current (PC) electrodeposition using a watt-type nickel plating solution, which contains SiC nanoparticles (NPs). Effects of the initial SiC NP concentration on the morphology, structure, crystal size, microhardness, and corrosion resistance of the resulting Ni-W-SiC thin films were investigated using by scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM), atomic force microscopy (AFM), microhardness tests, and electrochemical workstation. The results indicated that the surface of Ni-W-SiC films that were treated using 9 g/L SiC NPs had a fine-grained, smooth, and very uniform surface. Incorporating SiC NPs into the Ni-W-SiC thin-film influenced the metal grain sizes and microhardness of the layers. When the concentration of SiC NPs was 9 g/L, the average crystal size was 67 nm, and the microhardness was 881.7 HV. Moreover, the as-obtained film produced with a concentration of 9 g/L SiC had the minimum corrosion current value of 1.5 × 10−3 mA/cm2, which demonstrates its excellent corrosion resistance.



中文翻译:

脉冲电沉积制备Ni-W-SiC薄膜

本工作报道了使用Wt型镀镍溶液通过脉冲电流(PC)电沉积获得的Ni-W-SiC薄膜的制备,该溶液包含SiC纳米颗粒(NPs)。使用扫描电子显微镜(SEM),X射线衍射(XRD),扫描电镜和透射电镜研究了初始SiC NP浓度对所得Ni-W-SiC薄膜的形态,结构,晶体尺寸,显微硬度和耐蚀性的影响。透射电子显微镜(TEM),原子力显微镜(AFM),显微硬度测试和电化学工作站。结果表明,使用9 g / L SiC NP处理的Ni-W-SiC膜表面具有细粒度,光滑且非常均匀的表面。将SiC NP掺入Ni-W-SiC薄膜中会影响金属晶粒尺寸和层的显微硬度。当SiC NPs的浓度为9 g / L时,平均晶体尺寸为67 nm,显微硬度为881.7 HV。此外,所制得的浓度为9 g / L SiC的薄膜的最小腐蚀电流值为1.5×10-3  mA / cm 2,显示出优异的耐腐蚀性。

更新日期:2020-04-05
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