Abstract

To achieve bondlines with improved heat resistance and thermal conductance during operation, pressure-assisted sinter-bonding was performed in air with bimodal Ag-coated Cu particles for die attachment of the next-generation power devices composed of SiC. The bonding temperature and pressure were 250 °C and 10 MPa, respectively, and the sizes of the bimodal particles were 2 µm and 350 nm. After a short bonding time of 10 min, a paste with a 6:4 mixing ratio showed an average shear strength of > 20 MPa. The dewetting of Ag shells on the particles and void filling by the 350 nm particles induced rapid sintering.

Graphic Abstract

中文翻译：

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使用双峰Ag包覆的铜粒子在空气中250°C时的压力辅助烧结结合特性

摘要

为了在操作过程中获得具有改善的耐热性和导热性的键合线，在空气中用双峰Ag包覆的Cu颗粒进行了压力辅助的烧结键合，以压铸由SiC构成的下一代功率器件。结合温度和压力分别为250℃和10MPa，双峰颗粒的尺寸为2μm和350nm。在短短的10分钟粘合时间后，混合比为6：4的糊料显示平均剪切强度> 20 MPa。Ag壳在颗粒上的去湿和350nm颗粒的空隙填充引起快速烧结。

图形摘要