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Study on thermal degradation mechanism of heat-resistant epoxy resin modified with carboranes
Polymer Degradation and Stability ( IF 5.9 ) Pub Date : 2020-04-02 , DOI: 10.1016/j.polymdegradstab.2020.109143
Meili Cui , Lili Zhang , Pingping Lou , Xuezhong Zhang , Xiaojie Han , Zhijie Zhang , Shuhua Zhu

To generate a novel heat-resistant phenolic epoxy resin, carborane containing curing agent (1,7-bis(aminophenylene)meta-carborane) was synthesized and applied to cure the resin. The generated carborane-containing phenolic epoxy resin showed better thermal stability and thermal oxidative stability than carborane free phenolic epoxy resin. And the Lap Shear Strength of bonding samples showed the improved bonding performances. The thermal degradation mechanism of carborane-epoxy resin was investigated and the results showed that the carborane of samples was gradually oxidized to B2O3 at high temperatures, which covered at the surface of the adhesives to maintain the thermal resistance at high temperature.



中文翻译:

碳硼烷改性耐热环氧树脂的热降解机理研究

为了产生新型的耐热酚醛环氧树脂,合成了含有碳硼烷的固化剂(1,7-双(氨基亚苯基)间-甲碳烷)并将其固化。生成的含碳硼烷的酚醛环氧树脂显示出比无碳硼烷的酚醛环氧树脂更好的热稳定性和热氧化稳定性。粘结样品的搭接剪切强度显示出改善的粘结性能。研究了碳硼烷环氧树脂的热降解机理,结果表明,样品中的碳硼烷在高温下逐渐被氧化为B 2 O 3,并覆盖在胶粘剂的表面以保持高温下的耐热性。

更新日期:2020-04-03
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