The interface thermal resistance (ITR) of thermal interface materials is discussed in terms of electronic unit heat dissipation. To reduce the ITR of heat-conducting silicone grease (HCSG), low melting-point alloys (LMPAs) are introduced using boron nitride nanosheets (BNNS) via a simple route for thermal management. The results reveal that LMPAs uniformly compound and coat BNNS at the nanometer level. The BNNS narrows the LMPAs’ melting range. After reaching the melting point, the composite powder shows a degree of surface wettability. HCSG’s thermal conductivity, prepared using the above composite powder, reaches 1.8 W/(m·K), and its ITR drops from 13.8 to 0.547 °C·cm²/W. HCSG also has good recycling stability.

中文翻译：

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低熔点合金-氮化硼纳米片复合材料，用于热管理

根据电子单元的散热，讨论了热界面材料的界面热阻（ITR）。为了降低导热硅脂（HCSG）的ITR，通过氮化硼纳米片（BNNS）通过一种简单的热管理途径引入了低熔点合金（LMPA）。结果表明，LMPAs在纳米水平上均匀地复合和包覆BNNS。BNNS缩小了LMPA的熔化范围。达到熔点后，复合粉末显示出一定程度的表面润湿性。使用上述复合粉末制备的HCSG的导热系数达到1.8 W /（m·K），其ITR从13.8降至0.547°C·cm ² / W。HCSG还具有良好的回收稳定性。