Abstract

This paper presents an investigation of the effects of aging temperature on the microstructure and shear strength of SAC0307-0.1Ni/Cu solder joints. Single-overlap shear solder joints were aged for 1 h at 80, 130, and 180°C. The microstructure of the interface between the solder and the Cu substrate contained phase of the intermetallic compounds (IMCs) (Cu,Ni)₆Sn₅ formed along the interface. The shape of scallop-like (Cu,Ni)₆Sn₅ IMCs changed to the long dendrite and grew larger at the interface of solder joints after increased aging temperature. In addition, a phase of particle-like Ag₃Sn IMCs was formed in the solder matrix. The growth of the interfacial IMC layer in the solder joints increased with increasing the aging temperature. The thickness of this layer was controlled by diffusion mechanism. The shear strength of the as-reflowed solder joints was greater than that of the aged solder joints, and the shear strength of all the aged solder joints decreased with increasing the aging temperatures. Therefore, the aging temperature mainly affected the thickness of the interfacial layer of IMCs and the shear strength of the solder joints.

中文翻译：

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时效温度对铜接头SAC0307-0.1Ni无铅焊料组织和剪切强度的影响

摘要

本文研究了时效温度对SAC0307-0.1Ni / Cu焊点的组织和剪切强度的影响。单重叠剪切焊点在80、130和180°C下老化1 h。焊料和Cu衬底之间的界面的微观结构包含沿界面形成的金属间化合物（IMC）（Cu，Ni）₆ Sn ₅的相。时效温度升高后，扇贝状（Cu，Ni）₆ Sn ₅ IMC的形状变为长枝状，并在焊点的界面处增大。另外，颗粒状的Ag _3相在焊料基体中形成锡IMC。焊点中界面IMC层的生长随着时效温度的升高而增加。该层的厚度通过扩散机制控制。回流后的焊点的剪切强度大于老化的焊点，并且所有的老化的焊点的剪切强度都随着时效温度的升高而降低。因此，时效温度主要影响IMC界面层的厚度和焊点的剪切强度。