Abstract To solve the heat diffusion problem in electronic packaging, a novel kind of irregularly shaped hybrid filler, boron nitride@copper (BN@Cu), was successfully assembled via reduction of Cu2+. BN@Cu hybrid fillers composed of different mass ratios between BN and Cu have been prepared and characterized. A specific BN@Cu hybrid filler (mBN:mCu = 100:2), labeled as BN@2Cu, exhibited remarkable ability in enhancing the thermal conductivity of polybenzoxazine (PBz) composites fabricated through ball milling followed by hot pressing. With 25 wt% of BN@2Cu hybrid fillers, the thermal conductivity of PBz composites reaches 1.049 W m−1 K−1. Dielectric properties, electrical conductivity, and curing behavior of the composites were also investigated. In addition, Foygel's thermal conduction model was employed to demonstrate the mechanism of BN@2Cu hybrid filler in improving thermal conductivity.

中文翻译：

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基于沉积有铜​​颗粒的氮化硼薄片的高导热聚苯并恶嗪复合材料

摘要 为解决电子封装中的热扩散问题，通过还原Cu2+，成功组装了一种新型异形杂化填料氮化硼@铜（BN@Cu）。制备并表征了由不同质量比的 BN 和 Cu 组成的 BN@Cu 杂化填料。标记为 BN@2Cu 的特定 BN@Cu 混合填料 (mBN:mCu = 100:2) 在提高通过球磨和热压制备的聚苯并恶嗪 (PBz) 复合材料的导热性方面表现出显着的能力。使用 25 wt% 的 BN@2Cu 杂化填料，PBz 复合材料的热导率达到 1.049 W m-1 K-1。还研究了复合材料的介电性能、导电性和固化行为。此外，福伊格尔