Endow the implant with intrinsic communication system between sensors and actuators or between implant and patient is a key factor for its long-term success. The capacity of early diagnosis of failures and the ability to remedy them are necessary to minimize expensive complications and reducing revision procedures. Ti6Al4V is the most used titanium alloy for implant’s fabrication. In this sense, this work presents a promising approach to print communication systems by using laser technology, aiming integrate the smart components on titanium implants. Laser has been employed as a versatile tool to modify the surface in different ways, such as texturing, oxidizing and sintering. Silver wires have been printed on Ti6Al4V surface in order to conduct electrical current. To minimize current loss for the substrate, titanium oxide layer has been produced by different methods (laser and anodization). Laser sintering (LS) has been also compared to a conventional method (Hot-pressing- HP) to consolidate the silver powder into the cavities. In comparison to the conventional techniques, laser demonstrated to be a competitive approach to oxidizing the surface and also for consolidating the micro-wires on Ti6Al4V surface. Consequently, the micro-wires printed by laser approach presented satisfactory results in terms of electrical resistance, actuating as the conductor path for electrical current, with values of 0.0131 Ω, which is similar to the resistance of the wire printed in an insulator substrate.

为植入物提供传感器与执行器之间或植入物与患者之间的内在通信系统是其长期成功的关键因素。对故障进行早期诊断的能力以及对故障进行补救的能力对于最大限度地减少昂贵的并发症并减少修订程序是必不可少的。Ti6Al4V是用于植入物制造的最常用的钛合金。从这个意义上讲，这项工作提出了一种有前途的方法，即通过使用激光技术将打印组件集成到钛植入物上，从而实现打印通信系统。激光已被用作一种通用工具，以不同方式对表面进行修饰，例如纹理化，氧化和烧结。银导线已印刷在Ti6Al4V表面上以传导电流。为了使基板的电流损耗最小，钛氧化物层已经通过不同的方法（激光和阳极氧化）生产。还已将激光烧结（LS）与常规方法（热压HP）进行了比较，以将银粉固结到型腔中。与传统技术相比，激光被证明是一种氧化表面和在Ti6Al4V表面固结微丝的竞争方法。因此，通过激光方法印刷的微线在电阻方面表现出令人满意的结果，其作为电流的导体路径被激活，其值为0.0131Ω，这类似于在绝缘体基板中印刷的线的电阻。还已将激光烧结（LS）与常规方法（热压HP）进行了比较，以将银粉固结到型腔中。与传统技术相比，激光被证明是一种氧化表面和在Ti6Al4V表面固结微丝的竞争方法。因此，通过激光方法印刷的微线在电阻方面表现出令人满意的结果，其作为电流的导体路径被激活，其值为0.0131Ω，这类似于在绝缘体基板中印刷的线的电阻。还已将激光烧结（LS）与常规方法（热压HP）进行了比较，以将银粉固结到型腔中。与传统技术相比，激光被证明是一种氧化表面和在Ti6Al4V表面固结微丝的竞争方法。因此，通过激光方法印刷的微线在电阻方面表现出令人满意的结果，其作为电流的导体路径被激活，其值为0.0131Ω，这类似于在绝缘体基板中印刷的线的电阻。