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Three-dimensional entanglement on a silicon chip
npj Quantum Information ( IF 7.6 ) Pub Date : 2020-03-26 , DOI: 10.1038/s41534-020-0260-x
Liangliang Lu , Lijun Xia , Zhiyu Chen , Leizhen Chen , Tonghua Yu , Tao Tao , Wenchao Ma , Ying Pan , Xinlun Cai , Yanqing Lu , Shining Zhu , Xiao-Song Ma

Entanglement is a counterintuitive feature of quantum physics that is at the heart of quantum technology. High-dimensional quantum states offer unique advantages in various quantum information tasks. Integrated photonic chips have recently emerged as a leading platform for the generation, manipulation and detection of entangled photons. Here, we report a silicon photonic chip that uses interferometric resonance-enhanced photon-pair sources, spectral demultiplexers and high-dimensional reconfigurable circuitries to generate, manipulate and analyse path-entangled three-dimensional qutrit states. By minimizing on-chip electrical and thermal cross-talk, we obtain high-quality quantum interference with visibilities above 96.5% and a maximally entangled-qutrit state with a fidelity of 95.5%. We further explore the fundamental properties of entangled qutrits to test quantum nonlocality and contextuality, and to implement quantum simulations of graphs and high-precision optical phase measurements. Our work paves the path for the development of multiphoton high-dimensional quantum technologies.



中文翻译:

硅芯片上的三维纠缠

纠缠是量子物理学的反常理,它是量子技术的核心。高维量子态在各种量子信息任务中具有独特的优势。集成光子芯片最近已成为纠缠光子的生成,操纵和检测的领先平台。在这里,我们报告了一种硅光子芯片,该芯片使用干涉共振增强的光子对源,光谱解复用器和高维可重配置电路来生成,操纵和分析路径纠缠的三维量子态。通过最小化芯片上的电和热串扰,我们获得了可见性高于96.5%的高质量量子干涉,保真度达到95.5%的最大纠缠四态。我们进一步探索纠缠态量子态的基本性质,以测试量子非局部性和上下文性,并实现图的量子模拟和高精度光学相位测量。我们的工作为多光子高维量子技术的发展铺平了道路。

更新日期:2020-03-26
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