Temperature-responsive (or thermoresponsive) polymers belong to the most studied class of smart polymers and are mainly classified into two types based on their temperature-responsive behavior: lower critical solution temperature (LCST) and upper critical solution temperature (UCST). Based on polymeric design, when two temperature-responsive segments are connected through a covalent bond at each chain end, the block copolymers are expected to show a dual-temperature-responsive property upon conformational changes. Moreover, in recent years, multi-temperature-responsive properties that can represent complex states/structures have been reported. These multi-temperature-responsive block copolymers can set the stage for development in various research fields, such as drug-delivery carriers, sensors in solvents, model proteins, and memory storage. This review focuses on current multi-temperature-responsive polymeric materials and their applications and is divided into three parts: (1) dual-temperature-responsive block copolymers, (2) dual-temperature-responsive hydrogels, and (3) multi-temperature-responsive block copolymers. Temperature-responsive (or thermoresponsive) polymers belong to the most studied class of smart polymers and are mainly classified into two types based on their temperature-responsive behavior: lower critical solution temperature (LCST) and upper critical solution temperature (UCST). Based on polymeric design, when more than two temperature-responsive segments are connected through a covalent bond, the block copolymers are expected to show a multi-temperature-responsive property upon conformational changes. This review focuses on current multi-temperature-responsive polymeric materials and their future applications such as drug-delivery carriers, sensors in solvents, model proteins, and memory storage.

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多温度响应聚合物材料的最新进展

温度响应（或热响应）聚合物属于研究最多的一类智能聚合物，根据其温度响应行为主要分为两类：下临界溶解温度（LCST）和上临界溶解温度（UCST）。基于聚合物设计，当两个温度响应链段通过每个链端的共价键连接时，嵌段共聚物有望在构象变化时表现出双温度响应特性。此外，近年来，已经报道了可以表示复杂状态/结构的多温度响应特性。这些多温度响应嵌段共聚物可以为各种研究领域的发展奠定基础，例如药物输送载体、溶剂中的传感器、模型蛋白质和记忆存储。本综述着重于当前的多温度响应聚合物材料及其应用，分为三个部分：（1）双温度响应嵌段共聚物，（2）双温度响应水凝胶，以及（3）多温度响应-响应性嵌段共聚物。温度响应（或热响应）聚合物属于研究最多的一类智能聚合物，根据其温度响应行为主要分为两类：下临界溶解温度（LCST）和上临界溶解温度（UCST）。基于聚合物设计，当两个以上的温度响应链段通过共价键连接时，嵌段共聚物有望在构象变化时表现出多温度响应特性。