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A novel high entropy CoFeCrNiCu alloy filler to braze SiC ceramics
Journal of the European Ceramic Society ( IF 5.7 ) Pub Date : 2020-03-25 , DOI: 10.1016/j.jeurceramsoc.2020.03.044
Gang Wang , Yunlong Yang , Rujie He , Caiwang Tan , Marko Huttula , Wei Cao

In order to reduce intermetallic compound formations in brazed joints, a CoFeCrNiCu high entropy alloy was invented and employed to braze SiC ceramics. Results show that SiC ceramics were tightly and strongly brazed with the CoFeCrNiCu filler. Microstructure, phase and shear strength were systematically studied for joints brazed at different temperature. Main compositions were identified as high-entropy FCC, Cu(s, s), Si(s, s), and Cr23C6 phases, regardless the brazing temperature differences. After being brazed at 1453 K, the joint reached a maximum shear strength of 60 MPa, much higher than those brazed with conventional AgCuTi filler. Thanks to high entropy effect of CoFeCrNiCu filler, random solid solution turned out in the seam and benefitted joint quality. The successful use of CoFeCrNiCu high entropy alloy as fillers can expand the application range of high entropy alloys and provide a new filler system to braze ceramics.



中文翻译:

一种用于钎焊SiC陶瓷的新型高熵CoFeCrNiCu合金填料

为了减少钎焊接头中的金属间化合物的形成,发明了CoFeCrNiCu高熵合金,并将其用于钎焊SiC陶瓷。结果表明,SiC陶瓷与CoFeCrNiCu填料紧密紧密地钎焊在一起。系统研究了在不同温度下钎焊的接头的组织,相和剪切强度。鉴定出主要成分为高熵FCC,Cu(s),Si(s)和Cr 23 C 6相,无论钎焊温度差异如何。在1453 K钎焊后,接头的最大剪切强度达到60 MPa,远高于用传统AgCuTi填料钎焊的接头。由于CoFeCrNiCu填料的高熵效应,接缝中出现了无规固溶体,从而提高了接头质量。成功地将CoFeCrNiCu高熵合金用作填料可以扩大高熵合金的应用范围,并为钎焊陶瓷提供新的填料体系。

更新日期:2020-03-25
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