We propose a liquid cooling system incorporating a porous medium combined to the multiscale flow manifold. Specifically, this work compares two types of porous media by varying the porosity: the first type only includes a metal foam layer, and the second incorporates an additional circular pin-fin array within the metal foam. The thermohydraulic performances of each type such as the average junction temperature, temperature deviation, flow were investigated using both numerical and experimental approaches. Due to the influence of the additional thermal conductivity matrix by fin structure integration, the second configuration (metal-foam and pin-fin hybrid type) provides a higher thermal performance compared to the first one. The suggested cooling solution with the second configuration could provide a very low thermal resistance (∼0.185 K/W) with the pressure drop range between 5-15 kPa, which surpasses the performances of the previous-reported direct liquid cooling solutions such as the jet impingement, turbulator, and microchannel. This work will help develop high performance and compact cooling solutions for high power semiconductor applications such as an insulated gate bipolar transistor (IGBT) or a microprocessor.

我们提出了一种液体冷却系统，该系统将多孔介质与多级流量歧管相结合。具体而言，这项工作通过改变孔隙率比较了两种类型的多孔介质：第一种仅包含金属泡沫层，第二种在金属泡沫内包含附加的圆形针状翅片阵列。使用数值和实验方法研究了每种类型的热工液压性能，例如平均结温，温度偏差，流量。由于鳍结构集成对附加导热系数矩阵的影响，与第一个配置相比，第二种配置（金属泡沫和针鳍混合型）提供了更高的热性能。建议的第二种配置的冷却解决方案可以提供非常低的热阻（〜0。185 K / W）的压降范围在5-15 kPa之间，这超过了先前报道的直接液体冷却解决方案的性能，例如射流冲击，湍流器和微通道。这项工作将有助于为诸如绝缘栅双极晶体管（IGBT）或微处理器之类的大功率半导体应用开发高性能和紧凑的冷却解决方案。