Although conducting polymer composites have been active for several decades, the high percolation threshold and low operation temperature greatly limit their applications. We report a general and highly scalable strategy to make low percolation threshold and high-temperature polymer conductors composed of self-assembled carbon black (CB) networks in polyoxymethylene matrix. Our results demonstrated that the self-assembly properties of conductive particles in polymer melts can be tuned via adding a small amount (1 wt%) of polyamide copolymer, which has much stronger interaction with CB and lower viscosity compared with polymer matrix. The bridging polyamide chains which have a much higher melting point linked the CB particles together into conductive pathways, not only dramatically reducing the percolation threshold, but also retaining structural integrity and strong bonding even at elevated temperatures, and thus the composites have stable resistivities across a wide temperature range. Furthermore, due to the existence of polyamide chains in the CB networks, a remarkable enhancement in thermal stability of composites was obtained by the combined effects of physical isolation and chemical adsorption of reactive groups or free radicals. The present method offers an unprecedented opportunity for the development of low percolation threshold and high-temperature polymer conductors.

尽管导电聚合物复合材料已经使用了数十年，但其高渗透阈值和低操作温度极大地限制了它们的应用。我们报告了一种通用且高度可扩展的策略，以使低渗透阈值和由聚甲醛基体中的自组装炭黑（CB）网络组成的高温聚合物导体成为可能。我们的结果表明，可以通过添加少量（1 wt％）聚酰胺共聚物来调节聚合物熔体中导电颗粒的自组装性能，该聚酰胺共聚物与CB的相互作用要强得多，并且与聚合物基体相比具有较低的粘度。熔点更高的桥连聚酰胺链将CB颗粒连接到导电路径中，不仅大大降低了渗滤阈值，而且即使在高温下也能保持结构完整性和牢固的结合力，因此复合材料在宽温度范围内都具有稳定的电阻率。此外，由于CB网络中存在聚酰胺链，通过物理隔离和反应性基团或自由基的化学吸附的综合作用，复合材料的热稳定性得到了显着提高。本方法为开发低渗透阈值和高温聚合物导体提供了前所未有的机会。通过物理隔离和反应性基团或自由基的化学吸附的综合作用，复合材料的热稳定性得到了显着提高。本方法为开发低渗透阈值和高温聚合物导体提供了前所未有的机会。通过物理隔离和反应性基团或自由基的化学吸附的综合作用，复合材料的热稳定性得到了显着提高。本方法为开发低渗透阈值和高温聚合物导体提供了前所未有的机会。