In this letter, highly reliable white light-emitting diodes (WLEDs) were fabricated by using an all-inorganic packaging structure with a phosphor-in-glass (PiG) converter. The PiG was soldered on a three-dimensional substrate to realize the hermetic structure for WLEDs. The packaging structure displays the reliable and dense bonding layer between the PiG and the substrate. The thickness of phosphor glass layer was controlled to adjust the optical performances of WLEDs. At the thickness of $170~\mu $ m, the fabricated WLED achieves a white light with a luminous efficiency (LE) of 88.5 lm/W, a correlated color temperature (CCT) of 5274 K, and a color rendering index (CRI) of 67. After the accelerated aging test, the LE of fabricated WLEDs is only reduced by 9% and the related light quality shows no obvious shift.

中文翻译：

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玻璃中焊接磷光体的全无机封装结构的高可靠性 WLED

在这封信中，高度可靠的白光发光二极管 (WLED) 是通过使用带有荧光粉玻璃 (PiG) 转换器的全无机封装结构制造的。PiG 焊接在三维基板上以实现 WLED 的密封结构。封装结构显示了 PiG 和基板之间可靠且致密的键合层。控制荧光玻璃层的厚度以调节 WLED 的光学性能。在 $170~\mu $ m 的厚度下，制造的 WLED 实现了白光，发光效率 (LE) 为 88.5 lm/W，相关色温 (CCT) 为 5274 K，显色指数 (CRI) 67. 经过加速老化测试，制造的 WLED 的 LE 仅降低了 9%，相关光质量没有明显变化。