Transient liquid phase (TLP) bonding of directionally solidified Ni₃Al-based superalloy IC10 was carried out using a low boron Ni₃Al-based interlayer. The microstructure of TLP-bonded joints was analyzed by a scanning electron microscope and electron backscatter diffraction technique. The effects of the base metal dissolution, isothermal solidification and post-bond heat treatment on the migration of the main element in the interlayer and base metal were characterized. And a new design method of interlayer composition for TLP bonding superalloy is proposed. When the gap size is 0.08 mm, the ultimate tensile strength of the joint at 1100 °C after the PBHT is 268 MPa, which is 97 % of the base metal, the creep time of TLP-bonded joint at 1100 °C/ 36 MPa is more than 100 h, which is more than 90 % of the base metal. The crack initiated from the microvoids and appeared at the edge of the borides and carbides as well as the edge of the γ+γ' eutectic.

使用低硼Ni ₃进行定向凝固的Ni ₃ Al基高温合金IC10的瞬态液相（TLP）键合铝基中间层。通过扫描电子显微镜和电子背散射衍射技术分析了TLP键合接头的微观结构。表征了贱金属溶解，等温凝固和键合后热处理对中间元素和贱金属中主要元素迁移的影响。提出了一种新的TLP粘结高温合金中间层成分设计方法。当间隙尺寸为0.08 mm时，PBHT后1100°C时接头的极限抗拉强度为268 MPa，是母材的7％，TLP粘结接头在1100°C / 36 MPa时的蠕变时间超过100小时，超过母材的90％。裂纹从微孔开始，出现在硼化物和碳化物的边缘以及γ+γ'共晶的边缘。