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Mission Profile-based System-Level Reliability Prediction Method for Modular Multilevel Converters
IEEE Transactions on Power Electronics ( IF 6.7 ) Pub Date : 2020-07-01 , DOI: 10.1109/tpel.2019.2957826
Yi Zhang , Huai Wang , Zhongxu Wang , Frede Blaabjerg , Maryam Saeedifard

This article proposes a mission profile-based reliability prediction method for modular multilevel converters (MMCs). It includes key modeling steps, such as long-term mission profile, analytical power loss models, system-level and component-level thermal modeling, lifetime modeling, Monte Carlo analysis, and redundancy analysis. Thermal couplings and uneven thermal stresses among submodules are considered. A case study of a 15-kVA down-scale MMC has been used to demonstrate the proposed method and validate the theoretical analysis. The outcomes serve as a first step for developing realistic reliability analysis and model-based design methods for full-scale MMCs in practical applications.

中文翻译:

基于任务轮廓的模块化多电平转换器系统级可靠性预测方法

本文提出了一种基于任务曲线的模块化多电平转换器(MMC)可靠性预测方法。它包括关键建模步骤,例如长期任务概况、分析功率损耗模型、系统级和组件级热建模、寿命建模、蒙特卡罗分析和冗余分析。考虑了子模块之间的热耦合和不均匀的热应力。已使用 15 kVA 缩减 MMC 的案例研究来证明所提出的方法并验证理论分析。结果是在实际应用中为全尺寸 MMC 开发现实可靠性分析和基于模型的设计方法的第一步。
更新日期:2020-07-01
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