A bulk material electrode interfacing approach capable of enhancing the sensitivity of piezoresistive pressure sensors with magnitude orders is presented. Metal copper microwires are emplaced between the bulk conductive substrate and an electrode connecting it to the external circuit, replacing commonly used silver paste. These microwires create gaps on the interface between the two materials and increase the initial system resistance. As the applied pressure rises, the contact area between the substrate and microwires increases while the conductive substrate deforms, resulting in overall resistance reduction. With an appropriate setting of microwires, the sensitivity of the piezoresistive pressure sensor can be enhanced up to 10⁶‐fold. The current design is widely adaptable toward different types of materials and allows a pressure operation of up to 931.2 kPa. The results indicate that rather than developing bulk materials, straightforward improvements in the device connecting interface can significantly enhance pressure response sensitivity with magnitude orders.

中文翻译：

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数量级提高压阻压力响应装置的灵敏度

提出了一种散装材料电极接口方法，该方法能够以数量级提高压阻压力传感器的灵敏度。金属铜微线被放置在大块导电基板和将其连接到外部电路的电极之间，从而代替了常用的银浆。这些微线会在两种材料之间的界面上产生间隙，并增加初始系统电阻。随着施加压力的升高，基板和微线之间的接触面积增加，而导电基板变形，导致整体电阻降低。通过适当设置微线，可以将压阻式压力传感器的灵敏度提高到10 ⁶-折。当前的设计可广泛适用于不同类型的材料，并允许高达931.2 kPa的压力操作。结果表明，与开发散装材料不同，设备连接界面的直接改进可以显着提高压力响应灵敏度，幅度为数量级。