The packaging technology for transitions to dielectric waveguides in the frequency range above 100 GHz is complex and must be highly precise, and the waveguides are usually permanently connected. This letter presents a transition from a monolithic microwave integrated circuit (MMIC) to a flexible dielectric waveguide at $G$ -Band (140–220 GHz), which is self-aligning and, thus, reduces the requirements for packaging accuracy. Furthermore, the transition is mechanically decoupled to avoid mechanical stress to the MMIC and to reconnect it arbitrarily often. A patch radiator on a quartz-glass carrier is excited by a coupler on the MMIC. It feeds the $\mathrm {HE_{11}}$ mode into a rigid, high-permittivity dielectric dome, which increases the coupling efficiency. The flexible dielectric waveguide is placed above the dome and fixed with Rohacell half shells. The minimum insertion loss measured with a back-end-of-line (BEOL) MMIC is 3.0 dB at 168 GHz.

中文翻译：

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用于 G 波段 MMIC 的自对准和柔性介质波导插头

过渡到 100 GHz 以上频率范围内的介质波导的封装技术复杂且必须高度精确，并且波导通常是永久连接的。这封信展示了从单片微波集成电路 (MMIC) 到柔性介质波导的过渡 $G$ -Band (140–220 GHz)，它是自对准的，因此降低了对封装精度的要求。此外，过渡是机械解耦的，以避免对 MMIC 产生机械应力，并经常任意重新连接它。石英玻璃载体上的贴片辐射器由 MMIC 上的耦合器激发。它喂食 $\mathrm {HE_{11}}$ 模式进入刚性、高介电常数介质圆顶，从而提高耦合效率。柔性介质波导放置在圆顶上方并用 Rohacell 半壳固定。使用后端 (BEOL) MMIC 测得的最小插入损耗在 168 GHz 时为 3.0 dB。