A novel thermal latent curing agent, 2MZS, was obtained through the reaction of 2‐methylimidazole (2MZ) and a symmetrically carboxyl‐functionalized star‐shaped molecule based on cyclotriphosphazene (N₃P₃‐COOH). In the complex, the resonance of N₃P₃‐COOH reduced the activity of lone electron pairs on the pyridine‐type nitrogen atom of imidazole ring, suppressing the nucleophilic attack and crosslinking reaction between 2MZ and epoxy resin. As a result, the storage stability was improved distinctly for the one‐pot epoxy compound, which could be steadily stored at room temperature for nearly 1 month. Nonisothermal DSC revealed a delayed initiation curing mechanism of the prepared one‐pot system, and which could undergo rapid curing reaction upon raising the temperature. Moreover, the introduction of terminally polyfunctional star‐shaped phosphazene derivative could promote the curing process at elevated temperature, as well as improve the chain rigidity of the cured resin by chemical incorporation into the cross‐linked network, thus endowing the cured resin with enhanced glassy storage modulus. The epoxy thermoset exhibited the highest glass transition temperature and thermal degradation temperature when 20 wt% of 2MZS was used. It is suggested that the novel latent curing agent is potential for high‐performance one‐pot epoxy compound, particularly recommended for application in electronic packaging fields.

中文翻译：

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由2-甲基咪唑与含磷腈的多官能团羧酸中和而成的环氧树脂热潜在性固化剂

通过2-甲基咪唑（2MZ）和基于环_三磷腈（N ₃ P ₃ -COOH）的对称羧基官能化星形分子的反应，获得了一种新型的热潜伏性固化剂2MZS 。在络合物中，N ₃ P ₃的共振‐COOH降低了咪唑环的吡啶型氮原子上的孤电子对的活性，从而抑制了2MZ与环氧树脂之间的亲核攻击和交联反应。结果，单罐环氧化合物的储存稳定性显着提高，可以在室温下稳定储存近1个月。非等温DSC揭示了制备的单锅系统的延迟引发固化机理，并且在升高温度时可以进行快速固化反应。此外，引入末端多官能星形磷腈衍生物可促进高温下的固化过程，并通过化学结合到交联网络中来提高固化树脂的链刚性，从而使固化树脂具有增强的玻璃态。储能模量。当使用20 wt％的2MZS时，环氧热固性树脂表现出最高的玻璃化转变温度和热降解温度。建议新型潜伏性固化剂具有用于高性能一锅法环氧化合物的潜力，特别推荐用于电子包装领域。