The great popularity of portable, wearable, and implantable smart electronics has intensively boosted the development of flexible miniaturized power supplies. Owing to the fast charge/discharge capability, high power delivery, long cycling lifetime, easy fabrication and integration, flexible in-plane micro-supercapacitors (FPMSCs) are of significance as the micropower sources for the next-generation flexible on-chip electronics. In this review, we provide a comprehensive overview about FPMSCs and discuss the recent advances in their fabrication and applications. Particular emphasis is put on the emergent device fabrication technologies of FPMSCs, including deposition techniques, coating strategies, etching methods, and printing technologies. Moreover, we highlight the unique applications of FPMSCs in constructing smart responses and self-powered integrated systems in terms of multifunctional operation modes. Finally, the remaining challenges regarding flexibility, performance improvement, smart response, and microdevice integration of FPMSCs are discussed, which will stimulate further research in this thriving field.

便携式，可穿戴和可植入智能电子产品的广泛普及极大地推动了柔性微型电源的发展。由于快速的充电/放电能力，高功率输出，较长的循环寿命，易于制造和集成，柔性平面内微型超级电容器（FPMSC）作为下一代柔性片上电子器件的微功率源具有重要意义。在本文中，我们提供了有关FPMSC的全面概述，并讨论了其制造和应用方面的最新进展。特别强调了FPMSC的新兴器件制造技术，包括沉积技术，涂覆策略，蚀刻方法和印刷技术。此外，我们将重点介绍FPMSC在多功能操作模式下构建智能响应和自供电集成系统方面的独特应用。最后，讨论了有关FPMSC的灵活性，性能改进，智能响应和微设备集成方面的其余挑战，这些挑战将激发这一蓬勃发展的领域的进一步研究。