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Thermal conductivity and mechanical properties of polyimide composites with mixed fillers of BN flakes and SiC@SiO2 whiskers
Polymer Engineering and Science ( IF 3.2 ) Pub Date : 2020-02-28 , DOI: 10.1002/pen.25360
Yang Yang 1, 2 , Jiming Gao 2 , Ting Lei 1 , Jun Yang 2 , Jin Wang 2 , Jie Liu 2
Affiliation  

Polyimide (PI) composites with mixed fillers of BN flakes and SiC whiskers exhibit enhanced thermal conductivity and mechanical properties. In order to improve dispersion and interaction of these mixed fillers within the PI matrix, BN flakes were modified by a titanate coupling agent while SiC whiskers were oxidized at 750°C for 60 minutes to produce SiC@SiO2 followed by silane coupling agent modification. PI composites reached a maximum thermal conductivity of 0.95 W/m K at volume fraction of mixed fillers of 27.6 vol% when the weight ratio of BN flakes to SiC@SiO2 whiskers was 1:4. The enhanced thermal conductivity is likely attributed to the formation of heat conductive networks constructed by BN flakes and SiC@SiO2 whiskers and the improved interfacial affinity between fillers and matrix. The optimized Nielsen‐mold confirms the distribution and morphology of fillers affect the thermal conductivity of PI composites. In addition, SiC whiskers enhanced the mechanical property of PI composites and the influence of fillers on the mechanical property was further elaborated.

中文翻译:

BN片和SiC @ SiO2晶须混合填料的聚酰亚胺复合材料的导热性能和力学性能。

BN片和SiC晶须的混合填料的聚酰亚胺(PI)复合材料表现出增强的导热性和机械性能。为了改善这些混合填料在PI基体中的分散性和相互作用,用钛酸酯偶联剂改性BN片,同时将SiC晶须在750°C氧化60分钟以产生SiC @SiO 2,然后进行硅烷偶联剂改性。当BN薄片与SiC @SiO 2的重量比为27.6%(体积)时,PI复合材料的最大导热系数达到0.95 W / mK。晶须为1:4。增强的导热性可能归因于由BN薄片和SiC @SiO 2晶须构成的导热网络的形成,以及填料与基体之间界面亲和力的提高。经过优化的Nielsen-mold证实了填料的分布和形态会影响PI复合材料的导热性。此外,SiC晶须增强了PI复合材料的机械性能,并进一步阐述了填料对机械性能的影响。
更新日期:2020-02-28
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