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Effect of Heat Treatment Temperature on the Spinning Structure and Properties of a Cu–Sn Alloy
Microscopy and Microanalysis ( IF 2.8 ) Pub Date : 2019-11-22 , DOI: 10.1017/s1431927619015101
Jinli Liu , Wenyuan Zheng , Huiqin Yin

A thin-walled copper (Cu)–tin (Sn) alloy cylinder was treated after spinning at 200–400°C for 0.5 h. The characteristics of the alloy microstructure under different temperatures were analyzed through electron back-scattered diffraction. The results were as follows. The grain size at 200–300°C decreases as the heat treatment temperature rises, but the grain size at 400°C increases. At 200–300°C, the microstructure primarily consists of deformed grains. It is found that the main reason for the formation of high-angle grain boundaries (HAGBs) is static recrystallization. For the grain boundary orientation differential, the low-angle sub-grain boundary gradually grows into the HAGB, and multiple annealing twin Σ9 boundaries appear. Grain orientation is generally random at any temperature range. The mechanical property test indicated that, at the upper critical recrystallization temperature of 300°C, the elongation of the Cu–Sn alloy gradually increases, and its yield strength and ultimate tensile strength rapidly decrease.

中文翻译:

热处理温度对Cu-Sn合金纺丝组织和性能的影响

在 200-400°C 下旋转 0.5 小时后,对薄壁铜 (Cu)-锡 (Sn) 合金圆柱体进行处理。通过电子背散射衍射分析了合金在不同温度下的显微组织特征。结果如下。200~300℃的晶粒尺寸随着热处理温度的升高而减小,但400℃的晶粒尺寸增大。在 200–300°C 时,显微组织主要由变形晶粒组成。研究发现,形成高角度晶界(HAGBs)的主要原因是静态再结晶。对于晶界取向差异,小角度亚晶界逐渐向HAGB内生长,出现多个退火孪晶Σ9晶界。在任何温度范围内,晶粒取向通常是随机的。力学性能测试表明,
更新日期:2019-11-22
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