High-power-density electronics used in modern cellular devices and radiofrequency electronics generate tremendous localized thermal energy (up to 300 W/cm²), posing serious concerns regarding performance, life cycle, and safety. Further increasing the power density of these communications electronics requires effective methods to conduct generated heat away from critical components. In this work, a magneto-vibrational mold-casting technique is used to produce aligned and percolated thermal pathways through hexagonal boron nitride particles for effective steady-state passive cooling from high-density electronics. Additionally, 3D magnetic printing is used to produce custom thermal pathways. Thermal interface material testing (ASTM D5470) is utilized to determine system-level through-thickness thermal conductivity (K_⊥, including interfacial resistances) of up to 9 W/m-K, a >3-fold increase versus unaligned controls. These described new manufacturing approaches produce a unique class of castable and printable dielectric composites with high thermal conductivity.

现代蜂窝设备中使用的高功率密度电子设备和射频电子设备产生巨大的局部热能（高达300 W / cm ²），严重影响性能，生命周期和安全性。进一步提高这些通信电子设备的功率密度需要有效的方法，以将产生的热量从关键部件传导出去。在这项工作中，采用磁振动铸造技术来产生穿过六方氮化硼颗粒的对准且渗透的热通道，以实现高密度电子设备的有效稳态被动冷却。另外，3D磁性打印用于产生自定义的热通道。热界面材料试验（ASTM D5470）是利用厚度方向的热导率，以确定系统级（ķ _⊥（包括界面电阻）高达9 W / mK，与未对准的对照相比，增加了3倍以上。这些描述的新制造方法可生产出独特的具有高导热率的可浇铸和可印刷介电复合材料。