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Direct integration of micro-LEDs and a SPAD detector on a silicon CMOS chip for data communications and time-of-flight ranging
Optics Express ( IF 3.8 ) Pub Date : 2020-02-24 , DOI: 10.1364/oe.384746
J. F. C. Carreira , A. D. Griffiths , E. Xie , B. J. E. Guilhabert , J. Herrnsdorf , R. K. Henderson , E. Gu , M. J. Strain , M. D. Dawson

We present integration of singulated micron-sized light emitting diodes (micro-LEDs) directly onto a silicon CMOS drive chip using a transfer printing method. An 8x8 micro-LED device array with individual control over each pixel is demonstrated with modulation bandwidths up to 50 MHz, limited by the large modulation depth of the driver chip. The 2 kHz frame rate CMOS driver also incorporates a Single Photon Avalanche Diode device thus allowing detection and transmission functionality on a single integrated chip. Visible light communications at data rates up to 1 Mbps, and time-of-flight ranging with cm-scale resolution are demonstrated using this hybrid integrated system.

中文翻译:

微型LED和SPAD检测器直接集成在硅CMOS芯片上,用于数据通信和飞行时间测距

我们目前使用转移印刷方法将单个微米级发光二极管(micro-LED)集成到硅CMOS驱动芯片上。演示了具有对每个像素的单独控制的8x8 micro-LED器件阵列,其调制带宽高达50 MHz,受限于驱动器芯片的大调制深度。2 kHz帧频CMOS驱动器还集成了单光子雪崩二极管器件,从而允许在单个集成芯片上进行检测和传输。使用此混合集成系统演示了可见光通信,数据速率高达1 Mbps,飞行时间范围达到厘米级。
更新日期:2020-03-02
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