Abstract This paper presents the interfacial reaction and growth rate of Cu-Sn intermetallic compounds (IMCs) for various aging times in a composite preform for a die-attach material at high temperature. The feasibility of the composite preform we fabricated for power electronic applications to reduce the long bonding time of transient liquid phase (TLP) bonding was evaluated in this work. After the plating process, the composite preform was composed of Sn layers at both sides of the Cu core layer and the Cu layer. In terms of the aging treatment, the IMC layer was formed rapidly at the Cu-Sn interface in the composite preform by consuming the Sn layers, and the reduction and growth rates of Cu and Cu3Sn were calculated, respectively. We performed the TLP bonding process at 270 °C using various aged composite preforms. The Cu-Sn IMC was formed rapidly on both sides adjacent to the Cu core layer. The thickness of Cu decreased as the aging time elapsed. Therefore, the amount of Cu3Sn adjacent to the Cu core layer increased and the amount of Cu6Sn5 rapidly increased, simultaneously. We investigated the thicknesses and variations of the phase of the joint in the composite preform during the aging treatment process and sequential TLP bonding process for various times. We fabricated pre-annealed Sn/Cu/Sn preforms and performed fast Cu-Sn TLP bonding for high temperature power electronic applications.

中文翻译：

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使用预退火的 Sn/Cu/Sn 复合预制件快速形成用于高温接合应用的 Cu-Sn 金属间接头

摘要 本文介绍了Cu-Sn金属间化合物（IMCs）在高温下用于芯片粘接材料的复合预制件中不同老化时间的界面反应和生长速率。在这项工作中评估了我们为电力电子应用制造的复合预制件的可行性，以减少瞬态液相 (TLP) 键合的长键合时间。电镀工艺后，复合预制件由铜芯层和铜层两侧的锡层组成。在时效处理方面，通过消耗Sn层在复合预制件的Cu-Sn界面处快速形成IMC层，分别计算Cu和Cu3Sn的还原率和生长率。我们使用各种老化的复合材料预制件在 270 °C 下进行了 TLP 粘合工艺。Cu-Sn IMC 在与 Cu 芯层相邻的两侧迅速形成。随着时效时间的推移，Cu 的厚度降低。因此，与 Cu 芯层相邻的 Cu3Sn 的量增加，同时 Cu6Sn5 的量迅速增加。我们研究了不同时间的时效处理过程和顺序 TLP 键合过程中复合材料预制件中接头相的厚度和变化。我们制造了预退火的 Sn/Cu/Sn 预制棒，并为高温电力电子应用进行了快速 Cu-Sn TLP 键合。我们研究了不同时间的时效处理过程和顺序 TLP 键合过程中复合材料预制件中接头相的厚度和变化。我们制造了预退火的 Sn/Cu/Sn 预制棒，并为高温电力电子应用进行了快速 Cu-Sn TLP 键合。我们研究了不同时间的时效处理过程和顺序 TLP 键合过程中复合材料预制件中接头相的厚度和变化。我们制造了预退火的 Sn/Cu/Sn 预制棒，并为高温电力电子应用进行了快速 Cu-Sn TLP 键合。