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Accommodation of Silicon in an Interconnected Copper Network for Robust Li‐Ion Storage
Advanced Functional Materials ( IF 19.0 ) Pub Date : 2020-02-20 , DOI: 10.1002/adfm.201910249
Yanyan Liu 1 , Minghao Sun 1 , Yifei Yuan 2 , Qiang Wu 1 , Hongxun Wang 1 , Yi He 1 , Zhan Lin 1 , Fengli Zhou 3 , Min Ling 1 , Chao Qian 1 , Chengdu Liang 1 , Jun Lu 2
Affiliation  

Silicon (Si)‐based materials are one of the most promising anodes to be applied in rechargeable lithium ion batteries. However, the active Si/electrolyte interface causes continuous side reactions and poor conductivity, which significantly decreases the cycling stability. Cu is the only metallic current collector that has been known to promote electron conduction and lithium‐ion transfer without alloying reaction occurrence. However, to the best current knowledge, scalable interface engineering incorporating Cu has not been reported. Herein, this conductive Cu interface (CCI) is constructed through a self‐assembly carbothermic reduction method to achieve efficient protection of Si/electrolyte interfaces while allowing for fast Li+ diffusion. The energy barrier of lithium‐ion diffusion through Cu is calculated to be 0.1965 eV, which is much lower than that through Au, Fe, and Ni films. Benefiting from the enhanced interfacial protection and kinetics of Si with CCI, a fading rate of only 0.068% is maintained for 1000 cycles and an aerial capacity of 4.78 mAh cm−2 is achieved after 280 cycles, which is comparable to the industry standards required for practical application.

中文翻译:

在互连的铜网络中容纳硅,以实现可靠的锂离子存储

硅(Si)基材料是可用于可充电锂离子电池的最有希望的阳极之一。但是,活性硅/电解质界面会引起连续的副反应和差的电导率,从而大大降低循环稳定性。铜是已知的唯一可促进电子传导和锂离子转移而不会发生合金反应的金属集电器。但是,就目前所知,尚未报告包含Cu的可扩展接口工程。此处,此导电Cu界面(CCI)是通过自组装碳热还原法构建的,以实现对Si /电解质界面的有效保护,同时允许快速的Li +扩散。锂离子通过Cu扩散的能垒经计算为0.1965 eV,远低于通过Au,Fe和Ni膜扩散的能垒。得益于CCI增强的Si界面保护和动力学性能,在1000次循环中,褪色率仅维持0.068%,在280次循环后,其空载容量达到4.78 mAh cm -2,可与工业标准相媲美。实际应用。
更新日期:2020-04-06
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