Abstract

This research mainly prepared a bio-friendly electromagnetic interference (EMI) shielding fabric, and discussed the influence of the grammage (i.e. 120 g/m², 160 g/m² and 210 g/m², etc) of fabric substrate on the preparation of metal-based EMI shielding conductive fabric by electroless plating. A series of steps involved mercerization, dopamine (DoPA) modification, Ni0 seeding and electroless copper-nickel (Cu-Ni) plating were carried out to fabricate ideal EMI shielding fabric. The prepared Cu-Ni fabric endowed relatively high EMI shielding effectiveness (SE) (34.80-42.00 dB) ranging from 30 to 4500 MHz, which made it a huge potential in the field of wearable EMI shielding. Moreover, another discovery was that a relative higher grammage may lead to a lower total metal loading. Furthermore, Fourier transformation infrared (FTIR) spectroscopy and X-ray photoelectron spectroscopy (XPS) measurements were conducted to verify the introduction of functional groups in mercerization, modification and activation procedures. The crystalline phases and morphologies of resulting Cu-Ni coatings were characterized by X-ray diffraction (XRD) and field emission-scanning electron microscopy (FE-SEM) measurements. The atomic ratio (at.%) of Cu and Ni in the sample was determined by Energy Dispersive X-ray Spectroscopy (EDX) measurements. Overall, the Cu-Ni alloy fabric prepared in this research met the requirements of health, coating lining and EMI shielding.

中文翻译：

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化学镀法在丝光亚麻织物上生物启发性制备Cu-Ni涂层

摘要

该研究主要是制备的生物友好的电磁干扰（EMI）屏蔽织物，并讨论了克重的影响（如120克/米² 160克/米²和210克/米²等）在织物基材上通过化学镀制备金属基EMI屏蔽导电织物。进行了一系列步骤，包括丝光处理，多巴胺（DoPA）改性，Ni0晶种和化学镀铜镍（Cu-Ni）电镀，以制造理想的EMI屏蔽织物。制备的Cu-Ni织物在30至4500 MHz范围内具有较高的EMI屏蔽效能（SE）（34.80-42.00 dB），这使其在可穿戴EMI屏蔽领域具有巨大的潜力。此外，另一个发现是相对较高的克重可能导致较低的总金属负载量。此外，进行了傅里叶变换红外（FTIR）光谱和X射线光电子能谱（XPS）测量，以验证在丝光化，修饰和激活程序中引入了官能团。通过X射线衍射（XRD）和场发射扫描电子显微镜（FE-SEM）测量来表征所得Cu-Ni涂层的晶相和形貌。样品中Cu和Ni的原子比（原子％）通过能量分散X射线光谱（EDX）测量确定。总体而言，本研究制备的Cu-Ni合金织物满足卫生，涂层内衬和EMI屏蔽的要求。