We consider an advancing contact line traveling over a region of locally modified wetting or thermal substrate properties. A lubrication-type model is developed to account for coupling of viscous flow, evaporation, surface tension, and disjoining pressure. Stick-slip-type behavior is found for a range of conditions as the contact line passes over the defect and explained by a temporary increase in the local stresses disrupting the liquid supply into the contact line region. A simple estimate of the degree of contact line slowdown is obtained and compared with the numerical simulation results. Tangential stresses arising from the action of the electric field on the interfacial changes are accounted for in our model; neglecting them would lead to an overprediction of the time of interaction between the contact line and the defect. Increasing the substrate temperature uniformly has little effect on contact line motion, but local increase of the temperature enhances the tendency of the contact line to be pulled back by the defect, an effect explained by the Marangoni stresses.

中文翻译：

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前进的接触线与加热基板上的缺陷的相互作用

我们考虑了一条前进的接触线，该接触线在局部修改的润湿性或热基材性能区域上移动。开发了一种润滑型模型来解决粘性流，蒸发，表面张力和分离压力的耦合问题。在接触线越过缺陷时，在一定范围的条件下都发现了粘滑型行为，这可以通过局部应力的暂时增加来解释，这会中断向接触线区域的液体供应。获得了对接触线减速程度的简单估计，并将其与数值模拟结果进行了比较。在模型中考虑了电场对界面变化产生的切向应力；忽略它们会导致对接触线和缺陷之间相互作用时间的过度预测。