Two major research areas including assistive devices and Interconnect modelling for VLSI design are focused by Dr. Madhav Rao in IIIT-Bangalore. 3D interconnect is considered a solution to stack different functionalities on a system on chip (SoC), in a view to achieve faster computations and accommodate higher load on the chip. The 3D interconnects offers the luxury for the designers to not worry on the wiring and instead optimize the design independently. The research attempts to model 3D wirings using novel composite materials including Carbon nanotubes with Copper, instead of traditional wiring material to facilitate SoC performance with better interconnect design. Assistive robotic devices development to a growing uncared population is considered highly beneficial. In IIIT-Bangalore, Dr. Madhav Rao along with his students are working on developing assistive devices for clinical trials, and building devices for surgical purposes. The assistive robotics research covers range of device development aiding in upper limb movement, regular lower limb ankle actuation to overcome deep vein thrombosis, and ventricular assistance to promote blood flow for weak heart.

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研究重点

IIIT-班加罗尔的Madhav Rao博士专注于两个主要研究领域，包括辅助设备和用于VLSI设计的互连建模。3D互连被认为是在片上系统（SoC）上堆叠不同功能的解决方案，以实现更快的计算并适应芯片上的更高负载。3D互连为设计人员提供了奢华，他们无需担心布线，而是可以独立优化设计。该研究试图使用新型复合材料（包括带有铜的碳纳米管）替代传统的布线材料来对3D布线进行建模，以通过更好的互连设计来促进SoC性能。越来越多的无护理人员的辅助机器人设备的开发被认为是非常有益的。在IIIT-班加罗尔，博士 Madhav Rao和他的学生们一起致力于开发用于临床试验的辅助设备，以及构建用于外科目的的设备。辅助机器人技术的研究范围包括设备开发的范围，包括：上肢运动，规律的下肢踝关节动作以克服深静脉血栓形成以及心室辅助以促进弱心脏的血流。