The hydrofluoric acid (HF) is able to promote selective dissolution of the glassy phase in silica-based ceramic. However, the etching leaves insoluble silica-fluoride salts in the surface that affects negatively the bond, affirming the need of a post-etching cleaning. Evaluate the shear bond strength (SBS) of composite resin to CAD/CAM lithium-disilicate ceramics after different post-etching cleaning and silane treatments. Twenty-four 2 mm-thick slices of IPS e.max CAD (Ivoclar Vivadent, AG, Schann, Liechtenstein) were crystallized, embedded in acrylic resin, polished and cleaned in an ultrasonic bath. Each specimen was etched with 5% HF for 20 s, rinsed for 60 s, and treatment was completed using surface cleaning and silanization. The cleaning methods were: AW—air/water spray; UB—ultrasonic bath; PA—37% phosphoric acid; and ST—steam cleaning. The cleaned surface received: E—no silane treatment; E/S—silane application for 20 s, air drying for 20 s and hot drying (60 °C) for 20 s; E/S+—silane application for 60 s, air drying for 20 s, hot air drying (60 °C) for 20 s, rinsing with boiling water for 15 s and hot air drying for 20 s. Cylinders of composite resin (n = 12) (Z100, 3M-ESPE, Saint Paul, MN, USA) were bonded using an adhesive resin (Optibond FL adhesive, Kerr Corp, Orange, CA, USA). SBS testing was carried out after 24 h of storage in water. Samples for each post-etching cleaning regimen were analyzed by SEM. According to two-way ANOVA (Bonferroni-corrected post hoc tests, p < 0.05), the SBS was significantly influenced by the post-etching cleaning, with UB yielding the highest SBS (21 MPa for E/S); other post-etching cleaning regimens showed lower SBS values (12–17 MPa). The type of silane application was not significantly different. The SEM analysis showed a cleaner ceramic surface for UB when compared to the other groups. Etching lithium disilicate ceramics following by ultrasonic bath cleaning and regular application of a silane is recommended.

中文翻译：

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蚀刻后清洗会影响树脂对CAD / CAM二硅酸锂硅酸盐陶瓷的剪切粘结强度

氢氟酸（HF）能够促进玻璃相在二氧化硅基陶瓷中的选择性溶解。但是，蚀刻会在表面留下不溶的氟化硅盐，从而对粘接产生负面影响，这表明需要进行蚀刻后清洁。在不同的蚀刻后清洁和硅烷处理之后，评估复合树脂对CAD / CAM二硅酸锂陶瓷的剪切粘结强度（SBS）。将二十四片2毫米厚的IPS e.max CAD（Ivoclar Vivadent，AG，列支敦士登，Schann）切成薄片，嵌入丙烯酸树脂中，抛光并在超声浴中清洗。将每个样品用5％HF蚀刻20 s，冲洗60 s，并使用表面清洁和硅烷化处理完成。清洁方法为：AW-空气/水喷雾；UB——超声波浴；PA-37％磷酸；和ST-蒸汽清洁。清洁后的表面：E-未进行硅烷处理；E / S-硅烷施加20 s，空气干燥20 s，热干燥（60°C）20 s；E / S +-硅烷施加60 s，空气干燥20 s，热空气干燥（60°C）20 s，用沸水冲洗15 s和热空气干燥20 s。使用粘合剂树脂（Optibond FL粘合剂，美国加利福尼亚州奥兰治的Kerr Corp.，Optibond FL粘合剂）粘合复合树脂（n = 12）的圆柱体（n = 12）（Z100，3M-ESPE，美国明尼苏达州圣保罗）。在水中储存24小时后进行SBS测试。通过SEM分析每种蚀刻后清洁方案的样品。根据双向方差分析（Bonferroni校正的事后检验，p <0.05），SBS受蚀刻后清洗的影响很大，UB产生的SBS最高（E / S为21 MPa）。其他蚀刻后清洁方案显示出较低的SBS值（12-17 MPa）。硅烷的应用类型没有明显不同。SEM分析显示，与其他组相比，UB的陶瓷表面更清洁。建议在超声浴清洗和常规应用硅烷之后蚀刻二硅酸锂陶瓷。