New possibilities in the design of gold-containing electrochemical coating systems for electronic applications are given by the incorporation of gold-nanoparticles in metal-matrix-systems. The major problem for the application of nanoparticles is the strong agglomeration of the particles in the electrolyte solutions, preventing the incorporation of nanoscaled dispersants.A complete new concept for the deposition of nano dispersion layers, overcoming this agglomeration challenge, is the application of core shell systems. Using these systems, it becomes possible for the first time to incorporate metal nanoparticles into electrodeposited metal layers to form metal nanoparticle metal matrix systems (MNP-MMS). The advantage of such layers is to form nanocomposite materials far away from the thermodynamic equilibrium. Especially for the combination of gold nanoparticles with a nickel matrix, a way is shown for the manufacturing of temperature-stable nanocomposite structures, because at least in the temperature range of electronic applications no loss of the dispersive character by diffusion processes is expected. By incorporating the precious metal material into the nickel matrix as the main electrodeposit, and reducing the top gold layer thickness, a possible way of reducing the gold consumption and an economic use of gold resources is shown.

中文翻译：

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纳米金复合涂层制备的新进展

通过在金属基质系统中加入金纳米颗粒，为电子应用的含金电化学涂层系统的设计提供了新的可能性。纳米粒子应用的主要问题是电解质溶液中粒子的强烈团聚，阻止了纳米级分散剂的掺入。 纳米分散层沉积的全新概念，克服了这种团聚挑战，是核壳的应用系统。使用这些系统，首次将金属纳米颗粒掺入到电沉积金属层中以形成金属纳米颗粒金属基质系统（MNP-MMS）成为可能。这种层的优点是形成远离热力学平衡的纳米复合材料。特别是对于金纳米粒子与镍基体的组合，显示了一种制造温度稳定纳米复合结构的方法，因为至少在电子应用的温度范围内，预计不会因扩散过程而损失色散特性。通过将贵金属材料掺入镍基体中作为主要电沉积物，并降低顶层金层厚度，展示了一种减少金消耗和金资源经济利用的可能途径。