The buckling-based measurement of mechanical properties of material is reviewed here, which is a very useful technique for the characterization of thin films, nano- or molecular-scale materials, etc. This method is shown to be useful to measure elastic moduli of various thin films such as polymers, polyelectrolyte multilayers (PEM), single-wall carbon nanotubes (SWNT) and millimeter-thick polymer network substrates. Further, it is also shown that the mechanical properties of various organic electronic materials, which may find wide applications in flexible and/or stretchable electronic devices, can be measured by the buckling method. Due to its fast, simple nature, the method can be extended to many other materials, especially to materials existing in thin film form only. The method would be a valuable, complementary technique in mechanical characterization of materials to be added to existing methods such as tensile testing, nano-indentation, and other methods.

此处回顾了基于屈曲的材料机械性能测量，这是表征薄膜，纳米或分子级材料等的非常有用的技术。该方法被证明可用于测量各种材料的弹性模量薄膜，例如聚合物，聚电解质多层（PEM），单壁碳纳米管（SWNT）和毫米厚的聚合物网络基材。此外，还示出了可以通过屈曲方法来测量可以在柔性和/或可拉伸电子设备中找到广泛应用的各种有机电子材料的机械性能。由于其快速，简单的性质，该方法可以扩展到许多其他材料，尤其是仅以薄膜形式存在的材料。该方法将是有价值的，