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Selective Laser Melting of TiN Nanoparticle-Reinforced AlSi10Mg Composite: Microstructural, Interfacial, and Mechanical Properties
Journal of Materials Processing Technology ( IF 6.3 ) Pub Date : 2020-07-01 , DOI: 10.1016/j.jmatprotec.2020.116618
C. Gao , Z. Wang , Z. Xiao , D. You , K. Wong , A.H. Akbarzadeh

Abstract TiN nanoparticle reinforced AlSi10Mg composite powder was produced by a novel ultrasonic vibration dispersion technique. The TiN/AlSi10Mg composites were fabricated via selective laser melting (SLM). The effects of scanning speed on the microstructure, particle distribution state, and tribological properties of the as-built composites were studied. Experimental results showed a better SLM processibility for the composite powder due to the considerable improvement of laser absorption capacity. The microstructure of as-built composite parts was remarkably refined with a gradually decreased average grain size from 0.388 μm to 0.284 μm by increasing scanning speed compared to that of AlSi10Mg part (∼ 0.579 μm). Nano-sized TiN particles were evenly distributed and well-bonded in the composite matrix while minimized agglomerated TiN particles gathered and grew into large spherical clusters. Because of the in-situ reaction occurred between TiN cluster and AlSi10Mg matrix, novel graded interfacial layers were observed. The mean layer thickness increased from 0.11 μm to 0.38 μm by decreasing the scanning speed from 600 mm/s to 200 mm/s. Taking advantage of the dispersion strengthening, fine grain strengthening, and the graded interfacial layer, a considerably-high microhardness (145 ± 4.9 HV), and enhanced wear performance were achieved.

中文翻译:

TiN 纳米颗粒增强 AlSi10Mg 复合材料的选择性激光熔化:微观结构、界面和机械性能

摘要 采用新型超声振动分散技术制备了TiN纳米颗粒增强AlSi10Mg复合粉体。TiN/AlSi10Mg 复合材料是通过选择性激光熔化 (SLM) 制造的。研究了扫描速度对复合材料微观结构、颗粒分布状态和摩擦学性能的影响。实验结果表明,由于激光吸收能力的显着提高,复合粉末具有更好的 SLM 加工性能。与 AlSi10Mg 部件(~ 0.579 μm)相比,通过提高扫描速度,构建后的复合材料部件的微观结构显着细化,平均晶粒尺寸从 0.388 μm 逐渐减小到 0.284 μm。纳米尺寸的 TiN 颗粒在复合基体中均匀分布并结合良好,同时最大限度地减少了聚集的 TiN 颗粒聚集并生长成大的球形团簇。由于 TiN 簇和 AlSi10Mg 基体之间发生了原位反应,观察到了新的渐变界面层。通过将扫描速度从 600 mm/s 降低到 200 mm/s,平均层厚从 0.11 μm 增加到 0.38 μm。利用弥散强化、细晶强化和渐变界面层,实现了相当高的显微硬度(145±4.9 HV)和增强的耐磨性能。通过将扫描速度从 600 mm/s 降低到 200 mm/s,从 11 μm 到 0.38 μm。利用弥散强化、细晶强化和渐变界面层,实现了相当高的显微硬度(145±4.9 HV)和增强的耐磨性能。通过将扫描速度从 600 mm/s 降低到 200 mm/s,从 11 μm 到 0.38 μm。利用弥散强化、细晶强化和渐变界面层,实现了相当高的显微硬度(145±4.9 HV)和增强的耐磨性能。
更新日期:2020-07-01
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