Abstract The Copper/Graphene (Cu/Gr) composite was prepared with single-pass friction stir processing. The composites were prepared by fixing the tool rotational speed and by varying the traverse speed. The stir-zone of processed specimens were characterized for its microstructure, hardness and electrical conductivity. Microstructural investigation showed that graphene has uniformly distributed in the Cu-matrix. The hardness increased by up to 40% after FSP. A minimal decrease in electrical conductivity was observed after friction processing. The study showed FSP is a promising method to improve the mechanical properties of Cu without much deterioration in electrical conductivity.

中文翻译：

---

通过搅拌摩擦加工开发高强度和高电导率的 Cu/Gr 复合材料

摘要 采用单程搅拌摩擦工艺制备了铜/石墨烯（Cu/Gr）复合材料。通过固定工具旋转速度和改变横动速度来制备复合材料。加工试样的搅拌区的微观结构、硬度和电导率被表征。微观结构研究表明，石墨烯均匀分布在 Cu 基体中。FSP后硬度提高了40%。在摩擦处理后观察到电导率的最小下降。研究表明，FSP 是一种很有前景的方法，可以在不显着降低电导率的情况下提高 Cu 的机械性能。