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Does the stacking fault energy affect dislocation multiplication?
Materials Characterization ( IF 4.7 ) Pub Date : 2020-03-01 , DOI: 10.1016/j.matchar.2020.110136
Juan Li , Christoph Kirchlechner

Abstract This paper investigates the interdependence of the stacking fault energy (SFE) and the stress required for dislocation multiplication. For this purpose copper-aluminum (Cu-Al) alloys with varying Al content are investigated by spherical nanoindentation. The load-displacement curve shows a characteristic pop-in, which is interpreted as elastic-plastic transition and correlated to the dislocation source nucleation and/or activation stress. The statistical analysis of the pop-in behaviour documents a strong dependence of the maximum shear stress beneath the indenter on the Al content, which cannot be explained by a variation in shear modulus. Instead, the pop-in stress clearly increases with increasing stacking fault energy.

中文翻译:

堆垛层错能影响位错倍增吗?

摘要 本文研究了堆垛层错能 (SFE) 与位错倍增所需的应力之间的相互依赖性。为此目的,通过球形纳米压痕研究了具有不同 Al 含量的铜铝 (Cu-Al) 合金。载荷-位移曲线显示了一个特征性的突进,它被解释为弹塑性转变并与位错源成核和/或激活应力相关。突入行为的统计分析证明了压头下方的最大剪切应力对 Al 含量的强烈依赖性,这不能用剪切模量的变化来解释。相反,弹出应力随着堆垛层错能的增加而明显增加。
更新日期:2020-03-01
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