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New insight into organosilicon plasma‐enhanced chemical vapor deposition layers and their crosslinking behavior by calculating the degree of Si‐networking
Plasma Processes and Polymers ( IF 3.5 ) Pub Date : 2020-01-13 , DOI: 10.1002/ppap.201900202
Thorben Brenner 1 , Klaus Vissing 1
Affiliation  

An investigation into strongly organosilicon plasma‐polymeric coatings has been performed with the goal of developing a deeper understanding of the relationship between the physical properties and the chemical structure. The overall elemental composition has been analyzed using X‐ray photoelectron spectroscopy (XPS) and micro elemental analysis. Additional XPS peak fitting and Fourier‐transform infrared spectroscopy analysis have been undertaken and physical properties such as Young's modulus and mass density have been determined. The chemical structure of the coatings is discussed taking into account conventional Si–O crosslinking and also an independent second bridge‐building mechanism. Based on this suggestion, a least‐squares algorithm has been used to calculate the network structure including a new index for the degree of crosslinking. This enables very similar plasma‐polymeric coatings to be distinguished.

中文翻译:

通过计算硅网络化程度,对有机硅等离子体增强化学气相沉积层及其交联行为有了新的认识

已经对强有机硅等离子体聚合涂层进行了研究,目的是加深对物理性质与化学结构之间关系的理解。整体元素组成已使用X射线光电子能谱(XPS)和微量元素分析进行​​了分析。还进行了其他XPS峰拟合和傅立叶变换红外光谱分析,并确定了诸如杨氏模量和质量密度的物理性质。讨论了涂层的化学结构时,要考虑到常规的Si-O交联以及独立的第二桥结构。基于此建议,已使用最小二乘算法来计算网络结构,其中包括用于交联度的新指标。
更新日期:2020-01-13
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