Over the past few years, non-destructive testing plays an increasingly important role in the accuracy detection of PCB manufacturing. Due to the complexity of PCB materials and the development of PCB towards high density. So far, no method has been described which can semi-automatically detect the machining accuracy of PCB array holes based on three-dimensional structural data. Here, we propose an efficient method to detect the machining accuracy of PCB array holes by X-ray micro-CT. Firstly, the overall three-dimensional structural data of the sample was obtained by CT scanning and three-dimensional reconstruction. And then all the information of array holes could be extracted and visual analyzed. Finally, the measured values of PCB machining accuracy were gained according to the designed algorithms, such as straightness error, process capability index, cylindricity error and three-dimensional surface roughness. The method that based on X-ray micro-CT can get the results of PCB array holes’ machining accuracy precisely and efficiently. The same principle also provides a direction for promoting the development of micro-CT in PCB industry.

在过去的几年中，无损检测在PCB制造的精度检测中扮演着越来越重要的角色。由于PCB材料的复杂性以及PCB向高密度的发展。到目前为止，还没有描述可以基于三维结构数据半自动检测PCB阵列孔的加工精度的方法。在这里，我们提出了一种有效的方法来通过X射线微CT检测PCB阵列孔的加工精度。首先，通过CT扫描和三维重建获得样品的整体三维结构数据。然后，可以提取和视觉分析阵列孔的所有信息。最后，根据设计算法（如直线度误差，工艺能力指数，圆柱度误差和三维表面粗糙度。基于X射线微CT的方法可以准确，高效地获得PCB阵列孔的加工精度结果。相同的原则也为促进微型CT在PCB行业的发展提供了方向。