Abstract In physical vapor deposition (PVD), the energy and incident angle of ions can be adjusted easily by applying an electromagnetic field so that coatings with different structures and properties can be produced. In this work, several high-ionization coating techniques are employed to deposit TiAlN coatings to compare the effectiveness of each technique and resulting coating properties. The continuous high-power magnetron sputtering (C-HPMS) technique shows advantages in the deposition rate and coating performance. In addition, a deposition rate of 400 nm/min is achieved by C-HPMS, whereas those of high power impulse magnetron sputtering (HiPIMS) and arc ion plating (AIP) are 85 nm/min and 225 nm/min, respectively. The coating also shows a particle-free and dense morphology with a smaller surface roughness of 22.4 nm. Owing to efficient ionization, the TiAlN coating deposited by C-HPMS has a high hardness of 33.2 GPa which is comparable to those prepared by AIP and HiPIMS but with small residual stress. The results provide valuable information on how to choose the proper techniques and parameters to produce coatings with the desirable adhesion strength, tribological properties, as well as corrosion resistance.

中文翻译：

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不同高电离物理气相沉积技术沉积的TiAlN涂层的对比研究

摘要 在物理气相沉积（PVD）中，通过施加电磁场可以很容易地调整离子的能量和入射角，从而可以生产出不同结构和性能的涂层。在这项工作中，采用了几种高电离涂层技术来沉积 TiAlN 涂层，以比较每种技术的有效性和由此产生的涂层性能。连续高功率磁控溅射 (C-HPMS) 技术在沉积速率和涂层性能方面显示出优势。此外，C-HPMS 的沉积速率为 400 nm/min，而高功率脉冲磁控溅射 (HiPIMS) 和电弧离子镀 (AIP) 的沉积速率分别为 85 nm/min 和 225 nm/min。该涂层还显示出无颗粒且致密的形态，表面粗糙度较小，为 22.4 nm。由于高效电离，C-HPMS 沉积的 TiAlN 涂层具有 33.2 GPa 的高硬度，与 AIP 和 HiPIMS 制备的涂层相当，但残余应力较小。结果提供了关于如何选择合适的技术和参数来生产具有理想附着强度、摩擦学性能和耐腐蚀性的涂层的宝贵信息。