The ability to control the extent of metal nanoparticle (NP) embedding into polymer films has attracted attention for applications in quite a few research branches. In this study, the behavior of size‐selected copper NPs produced by the gas aggregation method and deposited on poly(methyl methacrylate) and polystyrene films is studied under thermal annealing above and below the glass transition temperature. Several important tendencies of the embedding dynamics in terms of dependence on NP size, annealing temperature, and time, as well as the type of polymer, are found and analyzed. Physical models explaining particle behavior and allowing the elaboration of practical recommendations on the controllable embedding of metal NPs into polymer films are suggested.

中文翻译：

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尺寸选择的铜纳米粒子可控制地嵌入聚合物薄膜中

控制金属纳米粒子（NP）嵌入聚合物薄膜的程度的能力已吸引了许多研究领域的应用关注。在这项研究中，研究了在高于和低于玻璃化转变温度的热退火条件下，通过气体聚集法生产并沉积在聚甲基丙烯酸甲酯和聚苯乙烯薄膜上的按尺寸选择的铜纳米管的行为。发现并分析了取决于NP尺寸，退火温度和时间以及聚合物类型的嵌入动力学的几种重要趋势。建议使用物理模型来解释粒子的行为，并允许详细阐述可控地将金属NP嵌入聚合物薄膜的实用建议。