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3D segregated architecture BaTiO 3 /polystyrene composites with enhanced dielectric constant fabricated via hot pressing core–shell polystyrene@BaTiO 3 composite microspheres
Journal of Materials Science: Materials in Electronics ( IF 2.8 ) Pub Date : 2020-01-10 , DOI: 10.1007/s10854-020-02856-3
Jian Ye , Biao Zhang , Yicheng Jin , Haoqian Zhang , Yingjie Qiao , Zhiguo Zhang

How to obtain high dielectric constant using low filler content is one of the urgent problems to be solved in the research field of ceramic/polymer dielectric materials. In traditional methods (fillers are randomly distributed), filler particles are isolated by thick layers of polymers (with low dielectric constant), which usually result in ultra-low enhancement efficiencies of dielectric constant for the composites. To solve the above puzzle, this study provides a new strategy to improve the dielectric constant of ceramic/polymer composites, that is constructing 3D segregated architectures of BaTiO3 (BT networks) in polystyrene (PS) matrix. This strategy is expected to enhance dielectric interaction between BT particles and greatly improve the dielectric constant of BT/PS composites. In this method, PS@BT core–shell microspheres were firstly fabricated by electrostatic self-assembling the BT particles on PS microspheres. BT/PS composites with BT networks were constructed by hot pressing above core–shell microspheres. Microstructures of PS@BT microspheres and BT/PS composites were investigated. Dielectric properties of BT/PS composites with various BT contents were studied. Results show that dielectric constant of the BT/PS composites is up to 41.8 when BT content is only 30vol%, which is much higher than that of traditional composites. This research provides us a facile method to design and fabricate ceramic/polymer composites with high dielectric constant and low loss.

中文翻译:

通过热压核-壳聚苯乙烯@BaTiO 3复合微球制备的具有增强介电常数的3D隔离结构BaTiO 3 /聚苯乙烯复合材料

如何以低填充量获得高介电常数是陶瓷/高分子介电材料研究领域亟待解决的问题之一。在传统方法中(填料是随机分布的),填料颗粒被厚厚的聚合物层(介电常数低)隔离,这通常会导致复合材料的介电常数超低提高效率。为解决上述难题,本研究提供了一种改善陶瓷/聚合物复合材料介电常数的新策略,即构建BaTiO 3的3D隔离结构。(BT网络)在聚苯乙烯(PS)基质中。该策略有望增强BT颗粒之间的介电相互作用,并大大提高BT / PS复合材料的介电常数。用这种方法,首先通过在PS微球上静电自组装BT颗粒来制造PS @ BT核壳微球。具有BT网络的BT / PS复合材料是通过在核-壳微球上方热压而构建的。研究了PS @ BT微球和BT / PS复合材料的微观结构。研究了不同BT含量的BT / PS复合材料的介电性能。结果表明,当BT含量仅为30vol%时,BT / PS复合材料的介电常数最高为41.8,远高于传统复合材料。
更新日期:2020-01-11
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